Technology background
There is societal pressure for environmental friendly products and systems, and this has driven new environmental legislation, mainly in Europe. Currently on the printed circuit boards two types of solder are used to fix the electronic components, the Pb-Sn weld (lead-tin) and the Lead-Free (without addition of lead) which contains several types of alloys. Lead-Free type solder still presents reliability problems, of price / stability of the cost of materials, and the high melting temperature. Thus, alternative solutions are sought, where other studies being developed reduce or completely remove the solder in the process of making a printed circuit board, but using resins as a means of fixation or not completely eliminating the weld . Therefore, alternatives that present initial solutions to the problem, not solving the problem of the separation of the components thereof and the subsequent reuse and / or recycling of these components.
Technology description
This invention consists of a method of manufacturing a printed circuit board without the use of solder as a means of joining the electronic components . This components are fixed using mechanical elements and the pressure as the only form of union, dispensing any type of weld.
Problems solved by the technology
The invention brings, as the main innovation the possibility of no use of weld for the electronic components fixation in a printed circuit board. The board is fabricated the same way until the process of components fixation., where these are fixed using the pressure through mechanical elements.
Technology Differentials
- Printed circuit boards manufactured without the use of solder as a means of fixing the electronic components
- Non-use of toxic materials for fixing components
- Fixation of the components using mechanical elements and pressure as the only form of union
- Easy disassembly of the motherboard components, for further reuse and / or recycling of components
- Reduction of the environmental impact
- Easy maintenance of the hob – disassembly and replacement does not cause damage to the hob
- Decrease in usual solder related problems, such as the formation of "whiskers", and others.
industrial application
This invention focuses on products of the category reliability class product 1, norm IPC-A-600G (IPC, 2004), which are electronic products in general, including products of consumption, the main requirement being the function of the printed circuit board, where aesthetic imperfections are not important. This class of product application represents the highest production volume, being the products of greater use and thus of greater consumption, generally having a short service life, generating environmetal problems.
Nível de Maturidade da Tecnologia (TRL – Technology Readiness Level)
Status
Patent pending
Inventors
André Canal Marques
Célia Malfatti
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Olá, We are students of UNA, We are doing research on technology and innovations and would like some information about the project.
The information we need, They are geared towards permitting processes required, market insertion and integration difficulties